Implant Communication based on 10-60 MHz Band Impulse-Radio Technology
Jianqing Wang, Beijing Institute of Technology
In view of the requirements for high-speed and highly reliable wireless implant communication, we have developed an implant transceiver working at 10–60-MHz band. The developed transceiver is based on an impulse radio technology with multi-pulse position modulation to increase the communication speed and reliability, and utilizes an automatic equalization technique to suppress waveform distortion and inter-symbol interference due to frequency-dependent tissue properties. The transmit antenna has a dimension in the order of 2 cm and a relative bandwidth of 16% by forming the radiation elements on a flexible magnetic sheet for miniaturization. Through an in vivo experiment on a living swine, we have shown the feasibility of implant communication in a depth up to 26 cm with a data rate of 10 Mb/s. These results demonstrate the superiority of this new technology over all others reported so far in the literature.
Jianqing Wang received the B.E. degree in electronic engineering from the Beijing Institute of Technology, Beijing, China, in 1984, and the M.E. and D.E. degrees in electrical and communication engineering from Tohoku University, Sendai, Japan, in 1988 and 1991, respectively. He was a Research Associate with Tohoku University, and a Senior Engineer with the Sophia Systems Company, Ltd. In 1997, he joined the Nagoya Institute of Technology, Nagoya, Japan, where he has been a Professor since 2005. He authored Body Area Communications (Wiley–IEEE, 2012).
Prof. Wang is the Chair of Japanese Society for Electromagnetics in Biology and Medicine, the Chair of Japan committee of International Union of Radio Science – Commission on Electromagnetics in Biology and Medicine (URSI-K), and the Vice-chair of Technical Committee on Electromagnetic Compatibility of the Institute of Electronics, Information and Communication Engineers (IEICE).
His current research interests include biomedical communications and electromagnetic compatibility.